发明名称 |
RADIATION-EMITTING SEMICONDUCTOR CHIP, METHOD OF MANUFACTURING THE SAME, AND METHOD OF ADJUSTING/SETTING BRIGHTNESS OF THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor chip structure allowing radiation emission to be adjusted and set in a target region during a manufacturing period. <P>SOLUTION: The brightness of this radiation-emitting semiconductor chip is adjusted and set by putting one or more absorptive and/or partially-insulating brightness-adjusting/setting layers (12, 6, 9) on a radiation output-combining surface (10) of a wafer during a manufacturing period of the semiconductor chip after measurement of radiation-emission characteristics of a radiation-emitting semiconductor layer column (3) of the wafer. <P>COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011044754(A) |
申请公布日期 |
2011.03.03 |
申请号 |
JP20100270445 |
申请日期 |
2010.12.03 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
ZOELFL MICHAEL;STEIN WILHELM;WIRTH RALPH |
分类号 |
H01L33/14;H01L31/00;H01L33/38 |
主分类号 |
H01L33/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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