发明名称 RADIATION-EMITTING SEMICONDUCTOR CHIP, METHOD OF MANUFACTURING THE SAME, AND METHOD OF ADJUSTING/SETTING BRIGHTNESS OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor chip structure allowing radiation emission to be adjusted and set in a target region during a manufacturing period. <P>SOLUTION: The brightness of this radiation-emitting semiconductor chip is adjusted and set by putting one or more absorptive and/or partially-insulating brightness-adjusting/setting layers (12, 6, 9) on a radiation output-combining surface (10) of a wafer during a manufacturing period of the semiconductor chip after measurement of radiation-emission characteristics of a radiation-emitting semiconductor layer column (3) of the wafer. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011044754(A) 申请公布日期 2011.03.03
申请号 JP20100270445 申请日期 2010.12.03
申请人 OSRAM OPTO SEMICONDUCTORS GMBH 发明人 ZOELFL MICHAEL;STEIN WILHELM;WIRTH RALPH
分类号 H01L33/14;H01L31/00;H01L33/38 主分类号 H01L33/14
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