SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor package is provided. The semiconductor package includes a carrier, a die, a metal sheet and a molding compound. The die is disposed on the carrier. The metal sheet has a first portion and a second portion, wherein a receiving space is defined by the first portion and the second portion, and the second portion is electrically connected to the carrier. The molding compound covers the die and the receiving space is filled by at least part of the molding compound.