发明名称 LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING SAME
摘要 An exemplary light emitting diode package includes a housing, and a light emitting unit received in the housing. The light emitting unit includes a first carbon nanotube layer, a plurality of spaced light emitting chips, and a second carbon nanotube layer. The light emitting chips are formed on the first carbon nanotube layer. The second carbon nanotube layer covers the light emitting chips.
申请公布号 US2011049536(A1) 申请公布日期 2011.03.03
申请号 US20100728260 申请日期 2010.03.21
申请人 HON HAI PRECISION INDUSTRY CO., LTD. 发明人 LOUH SEI-PING
分类号 H01L33/48;H01L21/50 主分类号 H01L33/48
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