发明名称 RADIATING PACKAGE MODULE IN EXOTHERMIC ELEMENT
摘要 PURPOSE: A radiating package module in a heating element is provided to improve structural reliability by applying a screw coupling method instead of a compulsive pressing method. CONSTITUTION: In a radiating package module in a heating element, a heating element(10) is mounted in a single-side of a heat conductive plate(20). The heat conductive plate includes a groove portion of a female screw shape. A heat pipe(20) is inserted into the groove portion. A heat pipe comprises a joint of a male screw shape. An adhesive is coated between the groove portion and the joint. A heat sink(40) is connected to one side of the heat pipe.
申请公布号 KR20110020491(A) 申请公布日期 2011.03.03
申请号 KR20090078131 申请日期 2009.08.24
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, JONG MAN;CHOI, SEOG MOON;SHIN, SANG HYUN;KIM, JIN SU
分类号 H01L23/36;H01L33/64 主分类号 H01L23/36
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