发明名称 BOND INJECTION APPARATUS
摘要 PURPOSE: A bond spraying apparatus is provided to simply clean a spraying nozzle and be capable of being immediately reusable after a panel manufacturing process is completed. CONSTITUTION: A bond supplying part supplies bond. A bond solvent part includes a solvent tank(20) and a third line(43). A first T-shape tube(52) connects the third line and an air line(44). A fourth line(45) is in connection with the first T-shape tube. A second T-shape tube(51) connects the fourth line and a second line(42). A spraying part(30) injects the bond, the solvent from the bond solvent part, and air from the air line.
申请公布号 KR20110020505(A) 申请公布日期 2011.03.03
申请号 KR20090078150 申请日期 2009.08.24
申请人 NO, MYUNG JUN 发明人 NO, MYUNG JUN
分类号 B05B7/26;B05B7/02;B05B7/30 主分类号 B05B7/26
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