| 摘要 |
Providing a method for manufacturing a package capable of achieving reliable anodic bonding between the bonding material 35 and a base board wafer 40 even when the bonding material 35 having a large resistance value is used. Providing a method for manufacturing a package by anodically bonding a bonding material 35, which is fixed in advance to an inner surface of a lid board wafer 50 made of an insulator, to an inner surface of a base board wafer 40 made of an insulator, the method including an anodic bonding step where an auxiliary bonding material 72 serving as an anode is disposed on an outer surface of the lid board wafer 50, a cathode 71 is disposed on an outer surface of the base board wafer 40, and a voltage is applied between the auxiliary bonding material 72 and the cathode 71, wherein the auxiliary bonding material 72 is made of a material that causes an anodic bonding reaction between the auxiliary bonding material 72 and the lid board wafer 50 in the anodic bonding step.
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