发明名称 DEEP TRENCH ISOLATION STRUCTURES BETWEEN HIGH VOLTAGE SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF
摘要 Deep trench isolation structures between high voltage semiconductor devices and fabrication methods thereof are presented. The high voltage semiconductor device includes a semiconductor substrate, pluralities of intersecting deep trench isolation structures defining several high voltage semiconductor device regions, and an island at the center of the intersection between the two deep trench isolation structures, wherein the two intersecting deep trench isolation structures h
申请公布号 US2011049668(A1) 申请公布日期 2011.03.03
申请号 US20090552613 申请日期 2009.09.02
申请人 LIN MING-CHENG;LO WEN-HSUN;PU SHIH-CHIEH;CHANG YU-LONG 发明人 LIN MING-CHENG;LO WEN-HSUN;PU SHIH-CHIEH;CHANG YU-LONG
分类号 H01L29/06;H01L21/762 主分类号 H01L29/06
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