| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an assembly of a rotary saw blade used in the semiconductor industry. <P>SOLUTION: The saw blade assembly for a gang saw for dicing a wafer includes a plurality of circular saw blades positioned along the common central axis, and a pitch spacer positioned along the common central axis between the adjacent saw blades and being eroded by polishing. The pitch spacer can be eroded to a desired diameter relative to the common central axis, by making the saw blade assembly come into contact with a polishing abrasive. Thus, saw blades of the saw blade assembly can be used for a long period, even if the blades are eroded. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
