| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin multilayer substrate where via conductors having predetermined performance are formed by preventing a conductive paste from protruding from a via conductor formed in a second resin layer, when the conductive paste constituting a via conductor formed on a first resin layer enters a setting state. <P>SOLUTION: The resin multilayer substrate includes a component built-in layer (first resin layer) and a thin resin layer (second resin layer) laminated on one surface of the component built-in layer. The resin multilayer substrate further includes a surface electrode formed on the surface of the thin resin layer on the opposite side to the surface laminated on the component built-in layer, a via conductor (first via conductor) provided to the component built-in layer and having one end extended to the one surface of the component built-in layer, and a via conductor (second via conductor) provided to the thin resin layer and having one end and the other end electrically connected to the surface electrode and the via conductor respectively. The via conductors are so arranged that positions of the center line of the via conductor and the center line of the via conductor are made different and the thin resin layer at the periphery of the via conductor overlaps at least part of the via conductor. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
