| 摘要 |
PROBLEM TO BE SOLVED: To prevent warpage of a semiconductor device having a structure with a thin semiconductor chip joined to a wiring board. SOLUTION: This semiconductor device includes: a first semiconductor chip 11; a wiring board 2 joined to one surface side of the first semiconductor chip; a wiring board 21 joined to the other surface side of the first semiconductor chip; a second semiconductor chip 12 joined to the opposite side to the first semiconductor chip 11 of the wiring board 21; an interlayer connecting member 51 interposed between the wiring boards 2 and 21; and a wiring board 22 joined to the opposite side to the wiring board 21 of the second semiconductor chip 12. The wiring boards 21 and 22 have functions as first and second warpage preventing boards, respectively. COPYRIGHT: (C)2011,JPO&INPIT |
