发明名称 METHOD FOR PERFORATING GLASS SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To efficiently form a large number of fine holes in a glass substrate. SOLUTION: A glass substrate 10 is put in a container 20. The container 20 is heated to soften the glass substrate 10 in the container 20. A porous plate 50 with hollow buried pipes 90 inserted into a large number of through-holes 51 formed in the plate is pressed against the softened glass substrate 10 and the buried pipes 90 are inserted into the glass substrate 10. The container 20 is then cooled to solidify the glass substrate 10 in a state that the buried pipes 90 are inserted, thereby forming holes 100 in the glass substrate 10. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011042531(A) 申请公布日期 2011.03.03
申请号 JP20090191838 申请日期 2009.08.21
申请人 TOKYO ELECTRON LTD 发明人 TAKEKOSHI KIYOSHI
分类号 C03B23/26 主分类号 C03B23/26
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