| 摘要 |
PROBLEM TO BE SOLVED: To improve positioning accuracy of a solder ball or the like to an external connection terminal, and improve reliability of connection between the external connection terminal and an electrode pad. SOLUTION: The semiconductor device 100 includes a substrate 111, electrode pads 113 and an insulating layer 115 both formed on the substrate 111, and solder balls 141 electrically connected to the electrode pads 113. The insulating layer 115 has openings 115a above the electrode pads 113. The semiconductor device 100 further includes metal films 161 connected to the electrode pads 113 in the openings 115a of the insulating layer 115 to receive the solder balls 141. The metal film 161 has a cup shape having a bottom 161a contacting the electrode pad 113 and a projection 161b which is the peripheral portion of the metal film projecting from the edge of the bottom 161a. COPYRIGHT: (C)2011,JPO&INPIT
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