发明名称 |
Circuit board, semiconductor package and method of manufacturing the same |
摘要 |
A circuit board includes a board part including a pattern portion on one surface thereof, the pattern portion being electrically connected to a semiconductor chip, and an under-fill layer disposed on the board part and exposing the pattern portion to the outside, the under-fill layer flowing to cover the pattern portion by heat generated in mounting the semiconductor chip. |
申请公布号 |
US2011048778(A1) |
申请公布日期 |
2011.03.03 |
申请号 |
US20090654306 |
申请日期 |
2009.12.16 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
HAN JONG WOO;YIM SOON GVU;KWEON YOUNG DO |
分类号 |
H05K1/16;H05K1/11;H05K3/10 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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