| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that there is a case wherein, especially, a seed film corrodes and a connection pad becomes thin to cause disconnection trouble etc., in a process of sticking and forming molten metal such as tin on a connection pad part when copper wiring of a circuit board for flip-chip mounting is formed by a semi-additive method. SOLUTION: After a photosensitive resin pattern is formed on a copper seed film on an insulating substrate and a buried wiring pattern of copper is formed at an opening part thereof, a peak part and a side face part of the buried wiring pattern are exposed from the photosensitive resin film through selective etching by a wet blast method. A tin plating pattern is stuck and formed at the exposed part by an electroless displacement plating method. Then the plating pattern is used as a mask to remove the remaining photosensitive resin film by the wet blast method again. In this process, the molten metal does not in contact with the seed film, then does not corrode. As a result of the process, the seed film does not corrode because of a structure wherein the both do not in contact with each other even in a mounting process, thereby suppressing thinning of the pattern during mounting. COPYRIGHT: (C)2011,JPO&INPIT
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