发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SURFACE PROTECTIVE TAPE |
摘要 |
A method for manufacturing a semiconductor device includes adhering an adhesive layer of a surface protective tape including a base material film, an intermediate layer disposed on the base material film, and the adhesive layer disposed on the intermediate layer to one surface of a semiconductor substrate; curing the intermediate layer while a flat plate is pressed against the base material film of the surface protective tape; grinding the other surface of the semiconductor substrate; curing the adhesive layer; and separating the surface protective tape from the semiconductor substrate.
|
申请公布号 |
US2011048615(A1) |
申请公布日期 |
2011.03.03 |
申请号 |
US20100874659 |
申请日期 |
2010.09.02 |
申请人 |
FUJITSU SEMICONDUCTOR LIMITED |
发明人 |
FUKAYA HIRONORI;SHIMOBEPPU YUZO;YOSHIMOTO KAZUHIRO;TESHIROGI KAZUO;URAGOU KAZUYUKI;SAKAMOTO MIKA;TAZAWA MASAYA |
分类号 |
B32B38/10;B32B3/30;B32B38/00 |
主分类号 |
B32B38/10 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|