METHOD FOR CUTTING LIQUID CRYSTAL PANEL

摘要

The present invention relates to a method for cutting a liquid crystal panel. The method for cutting a liquid crystal panel cuts the liquid crystal panel having an upper substrate and a lower substrate, and comprises: a step of forming a scribe line along a cut direction on the upper substrate and the lower substrate; and a step of applying external force from the outside of the scribe line in the direction of allowing the lower substrate to be bent toward the outer surface thereof, such that the upper substrate and the lower substrate are broken at the scribe line. The method of the present invention forms the scribe line on the upper substrate and the lower substrate, and applies external force in the direction of allowing the lower substrate to be bent toward the outer surface thereof, to break the upper substrate and the lower substrate, thereby preventing an orientation film existing in the viewing zone of the lower substrate from being damaged by the deformation of a spacer interposed between the upper substrate and the lower substrate.