| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for housing an optical semiconductor element which keeps an electrical connection state between the inside and outside thereof in good condition, and also to provide an optical semiconductor device. <P>SOLUTION: The package 3 for housing an optical semiconductor element includes a substrate 4 having a mounting region to mount an optical semiconductor element 2 on the top face, a frame 5 that is so formed as to surround the mounting region of the substrate 4 and has a through-hole in the side face, a signal line 6 that is formed in the through-hole to electrically connect the inside and outside of the frame 5, a support body 7 that is provided in a region surrounded by the frame 5 and has a space A in part of a lower part, and a wiring board 8 that is formed on the support body 7 and is electrically connected to the signal line 6. Due to this structure, the occurrence of cracks in the wiring board 8 is effectively suppressed, and an electrical connection state between the inside and outside of the package 3 is kept in good condition. <P>COPYRIGHT: (C)2011,JPO&INPIT |
