| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that allows the semiconductor device itself to be reduced in size, and to be high in the junction strength of a semiconductor chip without causing void between the semiconductor chip and a substrate. <P>SOLUTION: The semiconductor device includes a semiconductor chip 11, with electrodes 16 formed on the upper surface thereof, a substrate 21 having a die bonding region to which an adhesive material layer actually contacts out of an area for die-bonding the semiconductor chip thereto via the adhesive material layer 18, and a wire bonding region electrically connected to the electrodes via wires 17. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
