发明名称 |
METHOD FOR ELECTROLESS NICKEL-PALLADIUM-GOLD PLATING, PLATED PRODUCT, PRINTED WIRING BOARD, INTERPOSER AND SEMICONDUCTOR APPARATUS |
摘要 |
An object of the present invention is to provide an electroless nickel-palladium-gold plating method which is able, when performed on a plating target surface such as terminals of a printed wiring board, terminals of other electronic components, and other resin substrates with a fine metal pattern, to prevent abnormal metal deposition on a resin surface which is an undercoat and to provide a high-quality plated surface. Another object of the present invention is to provide a plated product with a high-quality plated surface, particularly such as an interposer and motherboard, and a semiconductor apparatus using the same. These objects were achieved by the electroless nickel-palladium-gold plating method of the present invention, which is a method for plating target objects such as terminals of a printed wiring board and in which at least one surface treatment selected from a treatment with a solution of pH 10 to 14 and a plasma treatment is performed at an optional step after the step of providing a palladium catalyst and before the step of performing electroless palladium plating.
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申请公布号 |
US2011051387(A1) |
申请公布日期 |
2011.03.03 |
申请号 |
US20100852522 |
申请日期 |
2010.08.09 |
申请人 |
SUMITOMO BAKELITE COMPANY, LTD. |
发明人 |
TACHIBANA KENYA;ITO TEPPEI;MITSUI YASUAKI |
分类号 |
H05K1/09;H05H1/00;H05K7/00 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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