| 摘要 |
The disclosed invention relates to apparatuses and techniques for a resistive heating device. The heating device may include a substrate, at least one electrically-conductive elongated structure disposed on the substrate, the at least one electrically-conductive elongated structure including at least one resistive portion having a conductivity lower than tha of the remaining portions of the at least one electrically-conductive elongated structure, and at least one heat- conductive column disposed on the at least one resistive portion of the at least one electrically-conductive elongated structure. |
