ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

摘要

Disclosed is an electronic device wherein a metal wire (119) is bonded to an electronic component (111), which is contained in a case (110), by means of wire bonding and bonding surfaces (121, 122) to which the metal wire (119) is bonded are covered with a synthetic resin (130). The electronic device is manufactured as follows: the synthetic resin (130) is poured into the case (110) in an amount such that at least a part of the metal wire (119) is exposed from the upper surface of the synthetic resin (130); then the case (110) into which the synthetic resin (130) has been poured is placed under a reduced pressure, so that the liquid level of the synthetic resin (130) is raised by pressure reduction and the part of the metal wire (119) exposed above the synthetic resin (130) is covered with the synthetic resin (30, 130).