UNIQUE MARK AND METHOD TO DETERMINE CRITICAL DIMENSION UNIFORMITY AND REGISTRATION OF RETICLES COMBINED WITH WAFER OVERLAY CAPABILITY
摘要
A combined metrology mark, a system, and a method for calculating alignment on a semiconductor circuit are disclosed. The combined metrology mark may include a mask misregistration structure and a wafer overlay mark structure.
申请公布号
US2011051150(A1)
申请公布日期
2011.03.03
申请号
US20100819281
申请日期
2010.06.21
申请人
KLA-TENCOR CORPORATION
发明人
CHOI DONGSUB;WIDMANN AMIR;SAIDIN ZAIN;LASKE FRANK;ROBINSON JOHN