| 摘要 |
This invention provides a silver thick film paste composition comprising a silver powder comprising silver particles, each said silver particle comprising silver components 100-2000 nm long, 20-100 nm wide and 20-100 nm thick assembled to form a spherically-shaped, open-structured particle, wherein the d50 particle size is from about 2.5 μm to about 6 μm. There is also provided a method of making a semiconductor device, and in particular a solar cell, using the silver thick film paste composition to form a front side electrode. |
