METHOD FOR PRODUCTION OF CHIP COMPONENT HAVING CONDUCTIVE POST, AND METHOD OF PRODUCTION OF SUBSTRATE HAVING BUILT-IN CHIP COMPONENT

摘要

Provided are a method for producing a chip component having a conductive post without causing damage to a terminal electrode of the chip component, and a method for producing a substrate having the chip component built therein. For formation of a conductive post, an aperture is formed by a photolithography technique through the insulating resist covering the terminal electrode of the chip component, and a conductive post is formed by electroplating using the aperture.