NOVEL POLYAMIC ACID, POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING SAME, AND DRY FILM PRODUCED FROM THE COMPOSITION

摘要

The present invention relates to a novel polyamic acid comprising a thermopolymerizable or photopolymerizable functional group, to a photosensitive resin composition which can form a high-resolution pattern, and which has a superior property of being developable with an aqueous alkaline solution, and which can provide a cured coating film having excellent flexibility, adhesion properties, soldering-heat resistance, and pressure cooker test (PCT) resistance, and to a dry film produced from the composition.