发明名称 ANISOTROPIC CONDUCTIVE MATERIAL, CONNECTION STRUCTURE, AND CONNECTION STRUCTURE PRODUCING METHOD
摘要 <p>Provided are an anisotropic conductive material including conductive particles, by which the reliability in conduction between electrodes which are electrically connected can be improved, and a connection structure using the anisotropic conductive material. The anisotropic conductive material contains a curable compound, a heat-curable agent, a light curing initiator, and conductive particles. In 100 wt% of the anisotropic conductive material, the content of the conductive particles ranges 1 to 19 wt%. the connection structure is comprised of a first member (2) to be connected, a second member (4) to be connected, and a connection portion (3) which connects the first and second members (2, 4). The connection portion (3) is formed by curing the anisotropic conductive material.</p>
申请公布号 WO2011024719(A1) 申请公布日期 2011.03.03
申请号 WO2010JP64077 申请日期 2010.08.20
申请人 SEKISUI CHEMICAL CO., LTD.;MAHARA, SHIGEO;KUBOTA, TAKASHI 发明人 MAHARA, SHIGEO;KUBOTA, TAKASHI
分类号 H01R11/01;H01B1/22;H01B5/16;H01R43/00 主分类号 H01R11/01
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