Package with a chip embedded between two substrates and method of manufacturing the same

摘要

A method of producing a substrate (300) with an embedded chip (110) is disclosed. This method comprises a first step of mounting a semiconductor chip (110) on a first substrate (100A) on which a first wiring (103A,103B)) is formed; and a second step of joining the first substrate (100A) with a second substrate (200) on which a second wiring (203A,203B) is formed. In the second step, the semiconductor chip (110) is encapsulated between the first substrate (100A) and the second substrate (200) and electrical connection is made between the first wiring (103A) and the second wiring (203B) so as to form multilayered wirings connected to the semiconductor chip (110). The encapsulation may occur by injection moulding. The first and second substrates (100A,200) may contain an electromagnetic shield layer (100P,200P).