发明名称 |
Cover for optoelectronic components |
摘要 |
A method for manufacturing a electronic and/or optoelectronic module comprises the following steps:
- mounting a electronic and/or optoelectronic chip on a board,
- making on the board an outer ring made from a liquid resin, the outer ring surrounding the electronic and/or optoelectronic chip,
- making a central filling of the volume defined by the outer ring, the central filling being made from a liquid resin and covering the top surface of the electronic and/or optoelectronic chip,
- curing in one single step the resin of the outer ring and the central filling and making a chemically linked interface between the outer ring and the central filling. |
申请公布号 |
EP2290716(A2) |
申请公布日期 |
2011.03.02 |
申请号 |
EP20100184330 |
申请日期 |
2007.10.16 |
申请人 |
LEDON LIGHTING JENNERSDORF GMBH;LUMITECH PRODUKTION UND ENTWICKLUNG GMBH |
发明人 |
SCHRANK, FRANZ;HOSCHOPF, HANS |
分类号 |
H01L33/56;H01L31/0203;H01L31/0216;H01L33/52;H01L33/60 |
主分类号 |
H01L33/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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