APPARATUS FOR DOUBLE SIDE POLISHING AND CARRIER FOR DOUBLE SIDE POLISHING APPARATUS

摘要

PURPOSE: A double side polishing apparatus and a carrier for the same are provided to variably adjust a location of a wafer, thereby actively coping with various factors of a dynamically changing polishing apparatus. CONSTITUTION: Upper and lower plates polish a wafer. A plurality of carriers comprises a center plate(210) with a mounting hole(211) and a circumference plate(220) with a gear. On the outer circumference of the center plate, a plurality of protrusions(213) is formed. A groove unit(223) corresponding to the protrusions is formed in an insertion groove of the outer circumference. A sun gear and an internal gear transfer a rotation force to the carrier.