发明名称 Hot melt adhesives with improved adhesion to low energy surfaces
摘要 Hot-melt adhesive composition (4) comprises (a) at least a polyolefin, which is solid at 25[deg] C, (b) at least a soft resin with a softening point of -10[deg] C to 40[deg] C, as measured by ring and ball method according to DIN EN 1238, and (c) at least a polar modified polyolefin wax. An independent claim is included for a composite body (1) comprising a first substrate (2), which is a polyolefin film, the hot-melt adhesive composition and a second substrate (3), where the hot-melt adhesive composition is disposed between the first and second substrate.
申请公布号 EP2290029(A1) 申请公布日期 2011.03.02
申请号 EP20090168705 申请日期 2009.08.26
申请人 SIKA TECHNOLOGY AG 发明人 URBACH, DIRK;PASCHKOWSKI, KAI;LINNENBRINK, MARTIN
分类号 C09J123/12 主分类号 C09J123/12
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