| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer flexible printed wiring board having such a structure that connection terminals, etc. can be arranged in many stages (in the plurality of number) in a flex portion. SOLUTION: A conductor pattern 12 is formed on one surface or on both surfaces of an insulation layer 11 formed of a flexible resin to fabricate a laminate, and an interlayer adhesive layer 13 is formed only on part of the laminate. A plurality of such laminates are pasted together by the interlayer adhesive layers 13, making only a part where the interlayer adhesive layers 13 are formed multilayered. An inner via 14 for interlayer continuity is formed in the multilayered portion M. The multilayer flexible printed wiring board manufactured by this method has a structure including the multilayered portion M and a single layer portion S wherein the conductor pattern 12 is exposed outside for each laminate. COPYRIGHT: (C)2006,JPO&NCIPI |
