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发明名称
Plasma treatment of organic solderability preservative coatings during printed circuit board assembly.
摘要
申请公布号
EP2288240(A3)
申请公布日期
2011.03.02
申请号
EP20100008337
申请日期
2010.08.10
申请人
LINDE AKTIENGESELLSCHAFT
发明人
LAUMEN, CHRISTOPH;FENG, EDWARD;ZHANG, BILL
分类号
H05K3/26;B23K1/20;B23K3/06;H05K3/34
主分类号
H05K3/26
代理机构
代理人
主权项
地址
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