| 摘要 |
<p>Procedure for manufacturing an article with a fibrous layer containing at least one electronic chip (7) consists of forming the fibrous layer (5) by depositing it on a surface (3) immersed in a dispersion (4) of fibrous material, and attaching the chips to an elongated flexible support (6) placed in contact with the fibrous layer. Procedure for manufacturing an article with a fibrous layer containing at least one electronic chip (7) consists of forming the fibrous layer (5) by depositing it on a surface (3) immersed in a dispersion (4) of fibrous material, and attaching the chips to an elongated flexible support (6) placed in contact with the fibrous layer so that the support and chips are integrated in the fibrous layer with no appreciable increase in its thickness. The support is a non-conductor of electricity, at least in the zones where the chips are located; it is preferably 1-10 mm wide, covered entirely by the fibres of the fibrous layer, and preferably coated on both sides with a heat sealing varnish. During the phase in which the support is covered by the fibrous layer the chips are positioned on the side of the support opposite the immersed surface (3), and both sides of the support are covered so that the chip is undetectable to both sight and touch.</p> |
