| 摘要 |
PURPOSE: A high frequency circuit having a multi-chip module structure is provided to form a low price multi module structure by making an integrated chip in a microwave and millimeter wave small. CONSTITUTION: In a high frequency circuit having a multi-chip module structure, semiconductor substrates(161-163) comprises a plurality of individual transistors(FET1-FET3). A first dielectric substrate(141-144) comprises capacitors(C1-C4). Second dielectric substrates(181,182) comprise a matching circuit. The individual transistor has a multi chip module structure and is arranged on the same semiconductor substrate. The plural individual transistors are arranged on a plurality of different substrates respectively. |
