发明名称 Bonding material composition and method for manufacturing the same, and joined body and method for manufacturing the same
摘要 <p>There is provided a bonding material composition for obtaining a joined body by unitarily joining two ormore members to be joined by means of a bonding material layer, wherein the bonding material composition contains flat particles, non-flat particles, smectite-based clay, and an inorganic adhesive as main components. The bonding material composition costs little, can relax thermal stress generated in the joined body without using fibers which may do harm to a human body, and can reduce defects such as a crack and a void upon drying or a thermal treatment. </p>
申请公布号 EP1930061(A3) 申请公布日期 2011.03.02
申请号 EP20070254730 申请日期 2007.12.06
申请人 NGK INSULATORS, LTD. 发明人 TOMITA, TAKAHIRO;MORIMOTO, KENJI;INOUE, KATSUHIRO;KAWAI, MASAAKI;KODAMA, SUGURU
分类号 B01D46/24;C04B28/24;C04B37/00;C04B38/00 主分类号 B01D46/24
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