| 摘要 |
<p>PURPOSE: A wire bonding structure and a manufacturing method of the same are provided to supply a bonding package suitable for high power and high temperature by forming interlayer between an electrode pad and a metal wire. CONSTITUTION: A wire bonding structure electrically interlinks a first electrode and second electrode pad(203a,203b) with a metal wire. The conductive junction material layer is formed on at least the first electrode pad and the second electrode pad. An interlayer(207) is contacted with one of the first electrode and the second electrode by a conductive junction material layer. The Interlayer is formed on the conductive junction material layer(206). The Interlayer comprises a bonding area of the metal wire(204).</p> |
