| 摘要 |
Compliant bonding of beam-leaded semiconductor devices is improved by deforming a compliant member into apertures of a rigid bonding grid during a bonding process. The deformation of the compliant member provides a desired clearance around brittle body portions of the semiconductor devices so that the body portions remain undamaged during bonding. In one example, the deformation takes place during exertion of bonding force and, in another example, just prior to the exertion of the bonding force. In still another example, the deformation is sufficient to cause complete shearing of the compliant member so that direct viewing of the device through the compliant member for alignment purposes can be effected.
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