发明名称 Semiconductor device having metal silicide layer on source/drain region and gate electrode and method of manufacturing the same
摘要 A semiconductor device includes a semiconductor substrate, an element-isolating region formed in the semiconductor substrate, a real element region formed in the semiconductor substrate and outside the element-isolating region and having a metal silicide layer formed on the surface thereof, and a dummy element region formed in the semiconductor substrate and outside the element-isolating region and having a metal silicide layer formed on the surface thereof. The ratio of the sum of pattern areas of the real element region and dummy element region occupied in a 1 μm-square range of interest including the element region is 25% or more.
申请公布号 USRE42180(E1) 申请公布日期 2011.03.01
申请号 US20080212105 申请日期 2008.09.17
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 OYAMATSU HISATO;HONDA KENJI
分类号 H01L21/28;H01L31/113;H01L21/285;H01L21/336;H01L21/76;H01L21/822;H01L21/8234;H01L21/8238;H01L27/02;H01L27/04;H01L27/088;H01L29/76;H01L29/78 主分类号 H01L21/28
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