| 摘要 |
A semiconductor device includes: an insulating film provided on a back surface of a semiconductor substrate; a plurality of isolation regions provided to reach the insulating film from a main surface of the semiconductor substrate; at least a first semiconductor layer and a second semiconductor layer which are electrically insulated from each other by the isolation regions in the semiconductor substrate; a first voltage applied terminal electrically connected to a front surface of the first semiconductor layer; a second voltage applied terminal electrically connected to a front surface of the second semiconductor layer; a selector circuit receiving voltages from the first voltage applied terminal and the second voltage applied terminal, and supplying an output in accordance with a combination of the voltages; and a conductive layer provided so as to contact with the insulating film provided to the back side of the semiconductor substrate.
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