发明名称 |
Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers |
摘要 |
A method of making a semiconductor device comprises forming a first conductive layer recessed below a surface of a substrate. The method further comprises forming a second conductive layer raised above the surface of the substrate to create a vertical offset between the first and second conductive layers. The method further comprises forming an interconnect structure on the first and second conductive layers.
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申请公布号 |
US7897502(B2) |
申请公布日期 |
2011.03.01 |
申请号 |
US20080207986 |
申请日期 |
2008.09.10 |
申请人 |
STATS CHIPPAC, LTD. |
发明人 |
JANG KIYOUN;KIM SUNGSOO;KANG YONGHEE |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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