发明名称 Method for low stress flip-chip assembly of fine-pitch semiconductor devices
摘要 A device including a first body (101) with terminals (102) on a surface (101a), each terminal having a metallic connector (110), which is shaped as a column substantially perpendicular to the surface. Preferably, the connectors have an aspect ratio of height to diameter of 2 to 1 or greater, and a fine pitch center-to-center. The connector end (110a) remote from the terminal is covered by a film (130) of a sintered paste including a metallic matrix embedded in a first polymeric compound. Further a second body (103) having metallic pads (140) facing the respective terminals (102). Each connector film (130) is in contact with the respective pad (140), whereby the first body (101) is spaced from the second body (103) with the connector columns (110) as standoff. A second polymeric compound (150) is filling the space of the standoff.
申请公布号 US7898083(B2) 申请公布日期 2011.03.01
申请号 US20090361768 申请日期 2009.01.29
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 CASTRO ABRAM M
分类号 H01L23/48;H01L23/52;H01L29/40 主分类号 H01L23/48
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