发明名称 |
Substrate heating apparatus, heating method, and semiconductor device manufacturing method |
摘要 |
A substrate heating apparatus having a conductive heater which heats a substrate includes a filament arranged in the conductive heater and connected to a filament power supply to generate thermoelectrons, and an acceleration power supply which accelerates the thermoelectrons between the filament and conductive heater. The filament has inner peripheral portions formed at a predetermined interval along an inner circle concentric with the substrate, outer peripheral portions formed at a predetermined interval on an outer circle concentric with the inner circle and having a diameter larger than that of the inner circle, and a region formed by connecting the end point of each inner peripheral portions and the end point of a corresponding one of the outer peripheral portions.
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申请公布号 |
US7897523(B2) |
申请公布日期 |
2011.03.01 |
申请号 |
US20090360378 |
申请日期 |
2009.01.27 |
申请人 |
CANON ANELVA ENGINEERING CORPORATION;CANON ANELVA CORPORATION |
发明人 |
SHIBAGAKI MASAMI;DOI HIROSHI;EGAMI AKIHIRO;SASAKI TOSHIAKI;HASEGAWA SHINYA |
分类号 |
H01L21/311;F27D11/00 |
主分类号 |
H01L21/311 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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