发明名称 |
Method for the production of a plurality of optoelectronic semiconductor chips and optoelectronic semiconductor chip |
摘要 |
A method for the production of a plurality of optoelectronic semiconductor chips each having a plurality of structural elements with respectively at least one semiconductor layer. The method involves providing a chip composite base having a substrate and a growth surface. A non-closed mask material layer is grown onto the growth surface in such a way that the mask material layer has a plurality of statistically distributed windows having varying forms and/or opening areas, a mask material being chosen in such a way that a semiconductor material of the semiconductor layer that is to be grown in a later method step essentially cannot grow on said mask material or can grow in a substantially worse manner in comparison with the growth surface. Subsequently, semiconductor layers are deposited essentially simultaneously onto regions of the growth surface that lie within the windows. A further method step is singulation of the chip composite base with applied material to form semiconductor chips. An optoelectronic semiconductor component is produced according to the method.
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申请公布号 |
US7896965(B2) |
申请公布日期 |
2011.03.01 |
申请号 |
US20040566521 |
申请日期 |
2004.07.22 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
HAERLE VOLKER |
分类号 |
C30B25/04;H01L21/20;H01L33/00 |
主分类号 |
C30B25/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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