发明名称 |
Epoxy resin composition for encapsulating semiconductor devices and semiconductor devices encapsulated therewith |
摘要 |
An epoxy resin composition comprising: (A) an epoxy resin having at least three epoxy groups per molecule and an epoxy equivalent of 170 or lower; (B) an epoxy resin having a phenolic nucleus and two epoxy groups in such an amount that a weight ratio of the epoxy resin (B) to the epoxy resin (A) ranges from 35/65 to 65/35; (C) a phenolic curing agent in such an amount that a molar ratio of phenolic hydroxyl groups to the whole epoxy groups in the composition ranges from 0.5 to 1.5; and (D) an inorganic filler in an amount of from 86 to 92 wt %, based on a total weight of the composition. The composition provides encapsulated semiconductor devices much less warped than those encapsulated with a conventional composition.
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申请公布号 |
US7898094(B2) |
申请公布日期 |
2011.03.01 |
申请号 |
US20070699370 |
申请日期 |
2007.01.30 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
OSADA SHOICHI;AOKI TAKAYUKI |
分类号 |
H01L23/29;B32B27/38;C08L63/00 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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