发明名称 |
Image sensor package and fabrication method thereof |
摘要 |
The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A bonding pad comprising a first opening is formed on an upper surface of the first substrate. A second substrate comprising a spacer element with a second opening therein is disposed on the first substrate. A conductive plug is formed in the hole and passes through the first and second openings to the second substrate to electrically contact with the bonding pad. A conductive layer is formed on a lower surface of the first substrate and electrically connects to the conductive plug. A solder ball is formed on the conductive layer and electrically connects to the bonding pad by the conductive plug. The image sensor package further comprises a second substrate bonding to the first substrate. The image sensor package is relatively less thick, thus, the dimensions thereof are relatively reduced.
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申请公布号 |
US7898070(B2) |
申请公布日期 |
2011.03.01 |
申请号 |
US20090543804 |
申请日期 |
2009.08.19 |
申请人 |
VISERA TECHNOLOGIES COMPANY LIMITED |
发明人 |
WENG JUI-PING;HSIEH JANG-CHENG;LIN TZU-HAN;ZUNG PAI-CHUN PETER |
分类号 |
H01L23/02;H01L21/00 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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