发明名称 |
METHOD OF MANUFACTURING PRINTED WIRING BOARD |
摘要 |
PURPOSE: A method for manufacturing a print wiring board is provided to easily expose a wiring pattern without the damage of the wiring pattern and the warpage of the print wiring board. CONSTITUTION: A wiring pattern(3) including a bonding pad(3a) and a solder ball pad(3b) is formed on the surface of an insulating board(1). A blast buffer layer(4) is formed to cover the wiring pattern. A prepreg(5) in which a thermosetting resin is immersed in glass fabric(2) is stacked on the blast buffer layer. The blast resist(6) with a resist aperture(6a) is formed on the wiring pattern. The prepreg exposed from the resist aperture is removed.
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申请公布号 |
KR20110019692(A) |
申请公布日期 |
2011.02.28 |
申请号 |
KR20100011831 |
申请日期 |
2010.02.09 |
申请人 |
CMK CORPORATION |
发明人 |
TAKAKUWA SHUICHI;SHIOBARA MASAYUKI;MINOWA YOSHITERU;YAMANOI AKIHIKO;HIRATA EIJI |
分类号 |
H01L23/12;H01L21/60;H05K1/03 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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