| 摘要 |
A power amplifying semiconductor element is mounted in a package 13, having a heat dissipating surface acting as high frequency ground as well. The package 13 is mounted upside down with flip-chip mounting method in a concave portion 12 formed on a housing 11 having a high frequency ground acting as a heat dissipating surface as well. A cooling mechanism 14 thermally independent from that of the housing 11 is arranged on a heat dissipating base surface of the package 13 facing upward. The cooling mechanism 14 is composed of a heat dissipating fin 15 and a heat pipe 16. The present invention can prevent thermal influence upon other electronic components and can improve greatly the degree of freedom on the designing of the cooling system, because the cooling mechanism of the power amplifying semiconductor element is made independent from that of the housing 11. |
