| 摘要 |
A system of mold locks ( 28, 30 ) is formed on a heatsink ( 2 ) of a packaged semiconductor to prevent/mitigate delamination. The mold locks ( 4, 12 ) anchor a plastic mold compound ( 34 ) that forms the protective cover for the packaged semiconductor die. The mold locks ( 4, 12 ) are miniaturized to allow the positioning of them within the flag portion of the heatsink ( 2 ) and leadframe ( 24 ) such that a semiconductor die can be anchored above the mold locks ( 4, 12 ) formed within the flag portion of the heatsink/lead frame ( 2, 24 ). The miniaturized size of the said moldlocks ( 4, 12 do not detract from the purpose of the die attach solder ( 36 ). |
