摘要 |
PURPOSE: A copper foil for a print wiring board, capable of recognizing the location of pattern after pattern formation, and a manufacturing method thereof are provided to form conductive patterns without the risks on stripping in the manufacturing processes of a print wiring board. CONSTITUTION: A copper foil for a printed circuit board is attached to the surface of the insulating material in order to form conductor patterns. The copper foil for the printed circuit board comprises a Ni-Co alloy plating layer(3). The insulating material is made of polyimide resin.
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