| 发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION FOR MEMS AND CURED PRODUCT THEREOF |
| 摘要 |
Disclosed is a photosensitive resin composition for an MEMS, which comprises (A) a photo-cationic polymerization initiator and (B) an epoxy resin having two or more epoxy groups on average per molecule, wherein the photo-cationic polymerization initiator (A) is a photo-cationic polymerization initiator (A-1) represented by formula (1). |
| 申请公布号 |
KR20110019391(A) |
申请公布日期 |
2011.02.25 |
| 申请号 |
KR20107029706 |
申请日期 |
2009.07.01 |
| 申请人 |
NIPPON KAYAKU KABUSHIKI KAISHA |
发明人 |
HONDA NAO;SAKAI RYO;IMAIZUMI NAOKO;ONO YOSHIYUKI |
| 分类号 |
G03F7/004;C08G59/68;G03F7/038 |
主分类号 |
G03F7/004 |
| 代理机构 |
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代理人 |
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